Specifications

Standard

Specialized

Number of Layers

1 - 12

14 40

Board Material

 

FR4

FR406

IS410

 

Aluminum Core

Arlon

CEM

Copper Core

FR408

Getek

Nelco 4000
Rogers 3000
Rogers 4000
Rogers 5000

Taconic TLY

Polyimide

Minimum Board Thickness

2 layer 0.010"

4 layer 0.020"

6 layer 0.020"

8 layer 0.062"

10 layer 0.062"

12 layer 0.062"

2 layer 0.005"

4 layer 0.010"

6 layer 0.031"

8 layer 0.040"

 

Maximum Board Thickness

 

2 layer 0.125"

3-12 layer 0.200"

 0.250"

 

Maximum Board Size

 

16" x 22"

12" x 21"

22" x 26"

 

10" x 16"

16" x 22"

12" x 21"

22" x 26"

Copper Thickness

 0.5 oz - 4 oz 

0.25 oz and 6 oz - 8 oz

Hole Aspect Ratio

6 : 1

15 : 1

Minimum Hole Size

0.008"

0.006"

Minimum Trace/Space

0.006"/0.006

0.003"/0.003"

Minimum Drill-to-Copper

0.010"

0.006"

Minimum Pitch

1 mm

0.5 mm

Final Finish

HASL (Solder)

Copper

Gold

Gold Fingers

White Tin

OSP

HASL

Gold (ENIG/Hard/Soft)

Selective Gold

Immersion Silver

OSP

White Tin

Solder Mask

 

LPI:

Green

Black

Red

Blue

Yellow

White

Clear

LPI:

Green

Black

Red

Blue

Yellow

White

Clear

Mix-and-match

Wet Mask

Dry Film

Silk Screen

 

White

Black

Yellow

White

Black

Yellow

Red
Blue 

Fabrication

 

Scoring

Route & Retain

Scoring

Jump Scoring

Route & Retain

Milling

Additional Features

 

Plated Slots

Non-plated Slots

Controlled Dielectric

Covered Vias

Counter Sinks

Counter Bores

Plated Edges

Controlled Impedance

Silver Filled Vias

 

Quality Standards

UL

IPC 6012 Class 2

Electrical Testing

IPC 6012 Class 3

100% Netlist Testing

TDR Testing

MIL-PRF-55110

Special Technology

 

Blind & Buried Vias

Metal Core Boards

Burn-in Board

Flex and Rigid-Flex

Environmental

 

Lead Free

RoHS Compliant

WEEE